Hydrofluoric Acid (HF) – Electronic Grade

Hydrofluoric Acid (HF) is one of the most critical etching chemicals used in semiconductor manufacturing. It is primarily used to remove silicon dioxide (SiO₂) from wafers and clean wafer surfaces at the nanometer level.

Key Details:
• Chemical Formula: HF
• Molecular Weight: 20.01 g/mol
• CAS Number: 7664-39-3
• Appearance: Colorless, fuming liquid
• Purity: ≥99.999% (5N–9N Electronic Grade)
• Boiling Point: 19.5°C

Applications:
• Etching and removal of silicon dioxide (SiO₂) on wafers
• Surface cleaning and oxide stripping in IC fabrication
• Used in Buffered Oxide Etch (BOE) solutions for controlled etching

Safety Note: Highly corrosive and toxic. Requires specialized handling, PPE, and HF emergency kits. Must be stored in Teflon-compatible containers.